, ? Les matériaux d'encapsulation (gels, résines)

, ? Les boîtiers (plastiques, hermétiques

. ?-l',

, Source : Mechatronic System Integration of the Hybrid Powertrain, Thomas Harder ECPE Workshop Adv. Power Electr. Pack

W. Sabbah, P. Bondue, O. Avino-salvado, C. Buttay, H. Frémont et al., High temperature ageing of microelectronics assemblies with SAC solder joints, Microelectronics Reliability, 2017.
URL : https://hal.archives-ouvertes.fr/hal-01564755

W. Gale and D. Butts, Transient liquid phase bonding, Science and Technology of Welding and Joining, vol.9, issue.4, pp.283-300, 2004.

H. Greve and F. P. Mccluskey, LT-TLPS Die Attach for High Temperature Electronic Packaging, Proceedings of the High Temperature Electronics Network (HiTEN), pp.246-253, 2013.

D. Bernache-assollant and J. Bonnet, Frittage : aspects physico-chimiques -Partie 1 : frittage en phase solide, vol.6, p.10, 2005.
URL : https://hal.archives-ouvertes.fr/emse-00497555

G. Bai-;-masson, W. Sabbah, R. Riva, C. Buttay, S. Azzopardi et al., Die attach using silver sintering. Practical implementation and analysis, Low-Temperature Sintering of Nanoscale Silver Paste for Semiconductor Device Interconnection, vol.16, pp.293-305, 2005.

J. Billore, S. Hascoët, R. Robutel, C. Buttay, and J. Li, Sintered-Silver Bonding of High-Temperature Piezoelectric Ceramic Sensors, IEEE Transactions on Components, Packaging and Manufacturing Technology, pp.1-7, 2016.
URL : https://hal.archives-ouvertes.fr/hal-01419042

I. S. References and . Hascoët, Mise en oeuvre de nouveaux matériaux d'assemblage dans les modules multipuces de puissance (MCM), vol.58, p.58, 2013.